3G Phone Offer of the Month
Today's 3G News
Low-Power LSI Incorporating MIMO Signal-Processing Technology for 3G Handsets
Kentrox Introduces WAN Gateway with 3G HSDPA Wireless
Ericsson to Launch 3G Network in Uruguay
RADVISION to Host 2007 IMS and 3G Face-to-Face Interoperability Event
Palm Launches 3G Treo 500v on Windows Mobile 6 for Vodafone
Symbian Welcomes the US 3G HSDPA Nokia N95
Nokia Revamps its Location-Based Experiences
Telefónica Móviles Introduces MC950D HSUPA USB Mobile Data Modem
Melita Cable and 3G Telecommunications Join Forces
Orange Announce New 3G HSDPA and Exclusive Handsets for Christmas 2007
3G Operator 3 Italia Launches Footie Offer
Mobile Broadband is Becoming a Mass Market
New Version of ProLab Testing Suite with End-to-End IMS Terminal and Server Support
Sony Ericsson S500i Review by 3G.co.uk
Billion Launches 3G / ADSL2+ Eireless Router with Auto Failover
Vodafone Offering Unlimited Music Downloads on 2.5G and 3G Handsets
EDGE, HSPA and LTE Provide Mobile Broadband Advantage to 3G and Beyond
World’s Smallest GPS RF Antenna Module with SiRFstarIII
Vodafone Announce New 3G HSDPA Handsets for Xmas
Handset Navigation Users Will Reach 43 million in 2012 
Cisco Demos Mobile TV
3G Subscribers Top 10 Million Mark for Softbank
Global Mobile Communication is 20 Years Old
Samsung G600 Review by 3G.co.uk
3G Phones Direct from 3G
Low-Power LSI Incorporating MIMO Signal-Processing Technology for 3G Handsets

Do you receive our FREE 3G Newsletter ? If not click here
13th September , 2007

ASIA Japan : NTT DoCoMo announced that it has developed and successfully tested a trial large-scale-integration (LSI) chip incorporating advanced power-saving signal-processing technologies that enable the chip to work at a sufficiently low power consumption and to be made small enough to fit into forthcoming Super 3G* handsets and beyond.

In the test, DoCoMo's LSI achieved a transmission rate of 200Mbps with high precision over a high-speed wireless network, while power consumption did not exceed 0.1W thanks to DoCoMo's proprietary signal-processing technology**.

The LSI demodulates and separates MIMO*** (multiple-input multiple-output) -multiplexed OFDM**** (orthogonal frequency division multiplexing) signals transmitted in the 20MHz bandwidth from four antennas. Signal processing is based on MLD (maximum likelihood detection) technology that DoCoMo has originally developed for 4G wireless access.

Redundant circuits have been eliminated in the experimental chip, which was made with 65 nanometer processing.

DoCoMo will continue to develop Super 3G and 4G technologies in combination with its LSI technology, as well as cooperate in the establishment of related international standards.


*Super 3G will provide superfast downlinks in excess of 100Mbps. Super 3G is called Long Term Evolution (LTE) in the 3rd Generation Partnership Project (3GPP).

**DoCoMo's proprietary signal-processing technology is based on MLD, the most accurate method available for separating MIMO-multiplexed signals. The MLD method separates MIMO-multiplexed signals by comparing the received signals and all possible signals to be transmitted to assess maximum likelihood. Although this guarantees accuracy it also requires very heavy computation, but DoCoMo's signal-processing technology reduces computation load while maintaining accuracy.

***MIMO uses multiple antennas on the same frequency to create different data streams that are multiplexed spatially.

****OFDM transmits fast data series using multiple sub-carriers in parallel. The method is especially robust in areas with multipath propagation, such as urban environments.

Anritsu Sponsor 3G