FREE 3G Newsletter mailing list
Email:

 

 

3G Sponsored by Tektronix

Over 90% of Mobile Network users benefit from Tektronix's Expertise and Test Equipment. Experience and knowledge are fundamental to your success. Meet Tektronix at the Empowerin3G Seminars. Click here to find out more
Free Network Wall Poster from Catapult
Free Network Wall Poster from Catapult - click for more info.
Nettest CMA 3000
CMA 3000 all-in-one field tester lets you analyze signals both out and back at the same time and with all interfaces!
3GMobile World Forum
The 3GMobile World Forum is now entering its fourth year with a new look and even bigger expectations. 2004 saw 450 senior global attendees, 75 exclusive top level presentations and 60 industry leading sponsors and partners. Since 2001, this essential event has grown and adapted to the 3G mobile telecom industry's needs and this year will be no exception. With a revamped format and most ambitious ever programme, the countdown is now on for 2005.
Free White Paper - Improving the 3G Customer Experience
Find out how operators can get ready to fulfil or exceed customer expectations. Click here for a free white paper from Tertio Telecoms, the experts in provisioning and mediation.

 

 

 
 

 

PowerQUICC III Processors for 3G Wireless

6th October , 2004

US : Freescale Semiconductor has achieved another milestone in the evolution of its high-performance PowerQUICC™ III architecture containing a PowerPC™ core.

Freescale today unveiled four next-generation PowerQUICC III processors with advanced features that specifically address the enterprise networking, telecom transmission and switching, 3G wireless infrastructure, storage and high-end imaging markets. Based on the e500 PowerPC system-on-chip (SoC) platform, the four PowerQUICC III processors are the most powerful PowerQUICC devices available, delivering gigahertz-class performance and a choice of high-speed interconnects for today's most demanding applications.

The four next-generation PowerQUICC III processors are the first PowerQUICC devices based on Freescale's 90 nanometer (nm) silicon-on-insulator (SOI) copper interconnect process technology, which enables processors to deliver high performance with low power dissipation. The 90 nm processors are designed to deliver a significant increase in performance over current 130 nm PowerQUICC III devices. The initial product versions are planned to operate at up to 1.33 GHz, with headroom to scale to 1.5 GHz.

"What makes these additions to our PowerQUICC III family both revolutionary and evolutionary is the combination of best-in-class performance and uncompromising integration targeting specific applications," said David Perkins, senior vice president of Freescale and general manager of Freescale's Networking and Computing Systems Group. "These four feature-rich, 90 nanometer processors herald the next wave of PowerQUICC III SoC devices-super-fast, power-efficient, highly integrated and optimized for the price/performance requirements of next-generation system designs."

"The demand for high-performance embedded processors that offer increased levels of integration to target certain end markets will continue to rise as OEMs search for optimized solutions to address their more advanced design requirements," said Sean Lavey, a semiconductor analyst at IDC. "These PowerQUICC III processors should find strong traction in next-generation systems as Freescale leverages an already solid position shipping PowerQUICC products into numerous markets, especially in communications and storage."

All four 90 nm PowerQUICC III processors incorporate an enhanced version of the e500 core designed to operate at up to 1.5 GHz at 90 nm. Initial offerings of this core are planned to scale from 800 MHz to 1.33 GHz. The enhanced e500 core connects to an integrated 512KB Level 2 (L2) cache, twice the size of the L2 cache available in current 130 nm PowerQUICC III products. The L2 cache is 8-way set associative and can be configured as cache or SRAM. The internal buses operate at up to double the rate of the previous 130 nm PowerQUICC III versions. The integrated DDR memory controller supports DDR SDRAM at up to 166 MHz (333 MHz data rate) and DDR2 SDRAM at up to 333 MHz (up to 667 MHz data rate, with initial offerings at 533 MHz data rate).

The four 90 nm PowerQUICC III processors include:

MPC8548E networking/telecom processor - Key features include 512KB L2 cache, integrated security engine, 64-bit DDR1/2 scaling to 667 MHz data rate, dual 32-bit PCI or 64-bit PCI-X, 4-bit Serial RapidIO® fabric technology and 4-bit PCI-Express (or single 8-bit PCI Express 1.0a), local bus IO interfaces, and four Gigabit Ethernet interfaces. The combination of these features makes this device an optimal communications processing solution for Ethernet-only or RapidIO interworking applications, such as enterprise networking, telecom transmission and switching and 3G wireless basestations. The security engine includes Kasumi algorithm acceleration, making the MPC8548E an ideal choice for enhancing security protocol processing in 2.5G and 3G wireless network infrastructure.

MPC8547E storage processor - Key features include 512KB L2 cache, integrated security acceleration with Exclusive Or (XOR) capability, support for battery-backed 64-bit DDR1/2 scaling to 667 MHz data rate, 64-bit PCI-X, 8-bit PCI Express and four Gigabit Ethernet interfaces. The device's XOR acceleration enhances system performance by offloading the compute-intensive parity checks in small-medium business (SMB) and enterprise redundant array of inexpensive disks (RAID) storage applications.

MPC8545E imaging processor - Key features include 512KB L2 cache, 64-bit DDR1/2 scaling up to 533 MHz data rate, integrated security, dual 32-bit PCI/single 64-bit PCI, 4-bit PCI Express and two Gigabit Ethernet interfaces. The MPC8545E also offers double precision floating point, a capability that makes this device a high-performance processing solution for a wide range of imaging applications.

MPC8543E general-purpose control processor - Key features include 256KB L2 cache, integrated security, 64-bit DDR1/2 scaling up to 400 MHz data rate, 32-bit PCI, 4-bit Serial RapidIO or 4-bit PCI Express, and two Gigabit Ethernet interfaces. With clock frequencies scaling from 800 MHz to 1 GHz, this cost-effective device is ideally suited for a wide range of general-purpose embedded control applications, such as robotics, discrete manufacturing and process manufacturing control.

The MPC8548E device is the first integrated communications processor to comply with the Serial RapidIO Interconnect Specification, Revision 1.2, from the RapidIO Trade Association. The RapidIO serial fabric interface is ideal for connecting MPC8548 processors and peripherals in high-performance distributed systems. Examples include control plane processing, protocol processing and other compute-intensive applications requiring high-speed, peer-level communications with a low pin count, such as those found in AdvancedTCA platforms. The RapidIO ecosystem is more than 50 members strong and includes industry-leading embedded vendors who provide host processors, DSPs, communications processors, backplane interfaces, switches, systems, tools, operating systems and services.

The security engine integrated into each of the 90 nm PowerQUICC III devices accelerates a wide range of algorithms and modes, including DES/3DES, AES, ARC-4, Kasumi, MD5, SHA1/2, RSA and Elliptic Curve and also provides a hardware random number generator. The security engine enables the PowerQUICC III processors to offer up to 1 Gbps throughput for widely used commercial security protocols, such as IPSec, SSL/TLS and 3GPP.

The next-generation 90 nm PowerQUICC processors are supported by CodeWarrior® development tools from Freescale and by a comprehensive ecosystem of development tools, operating systems and applications from third-party vendors working through Freescale's Smart Networks Alliance Program.

Pricing and Availability
Initial samples of the MPC8548E, MPC8547E, MPC8545E and MPC8543E processors are planned for Q2 2005.

Visit 3G's Own 3G Mobile Store

Click to visit the 3G Forum
Latest PRESS RELEASES
TODAY'S PRESS RELEASES
All Material Subject to Copyright. All logos, graphics and trademarks are the property of their respective owners.