ASIA
: NEC introduced the MP211, the industry’s first application
processor for mobile phones with three internal CPU cores. The new
product leverages NEC Electronics’ parallel processing and low
power consumption technologies, enabling high performance multimedia
processing such as terrestrial digital broadcast reception, videophone,
and music playback while maintaining low power consumption.
Main Features
of the MP211
Three ARM CPU
cores and new software enable optimized processing for multiple mobile
phone applications and offer higher performance. Compatibility with
software previously used with single-CPU application processors minimizes
development time.
Linux OS platform
offers greater flexibility and efficiency in software development,
allowing development using open source software.
Includes NEC Electronics’
proven digital signal processor (DSP), with industry-leading sales
of more than 160 million units in Japan, which allows optimal processing
of multimedia applications via software. With this DSP, high performance
applications such as terrestrial digital broadcast reception and videophone
functions can be operated without accessing the hardware.
New bus architecture
allows the three CPU cores and the DSP to share just one memory unit,
simplifying circuitry around the memory chip and enabling high speed
data transfer, leading to improved performance compared to previous
single-CPU architectures.
Combination of
above-mentioned multi-CPU and DSP technologies, together with low
power consumption technologies, reduces power consumption by approximately
30 percent (for terrestrial digital broadcast reception and videophone
operations, compared with single-CPU application processors).
“Parallel
processing technology is a key to enabling enhancement of future applications,
especially those that require both high performance and low power
consumption,” stated Yoshiharu Tamura, General Manager, Mobile
Terminal Unit, NEC Corporation. “With the addition of the Linux
operating system, we can expect greater usability and more efficient
development.”
Recently, mobile phone requirements have shifted dramatically from
traditional functions such as standard calling and camera features,
toward feature-rich functions such as videophone, animation and games,
music playback, e-money, navigation systems, and terrestrial digital
broadcast reception. In coming years, an even greater array of services
is expected.
With these changes, hardware and software development for mobile phones
has become increasingly complex, requiring greater resources. For
mobile phone developers, it is critical to solution that simultaneously
enables both high performance and low power consumption, while minimizing
development time by ensuring backward compatibility with existing
application software.
However, adding high performance functions such as image and audio
processing to current single-CPU application processors results in
higher CPU operating frequencies, which leads to higher power consumption
and ultimately reduced talk time and standby time.
The MP211 application processor solves this dilemma by simultaneously
providing higher performance and lower power consumption, and will
be an integral part of NEC Electronics’ lineup of solutions
for the mobile phone space. NEC Electronics will demonstrate the MP211,
as well as other new products, at CEATEC Japan 2004, beginning October
5th at Makuhari Messe.
Availability
The application processor will be available in combination with DDR
SDRAM in a stacked System in Package (SiP) format, ideal for the small
geometries of mobile phones. Samples will be available starting in
January 2005. Volume production is expected to begin in the first
half of 2005, with monthly production to reach 1 million units by
2007. Availability is subject to change.
MP211 Specifications
CPUs: three ARM926EJ-S cores
Operating frequency: 200MHz (max.)
Instruction cache: 16KB per CPU
Data cache: 16KB per CPU
DSP: NEC Electronics
DSP core
Operating frequency: 200MHz (max.)
Instruction cache: 16KB
Instruction RAM: 64KB
Data RAM: 64KB
640KB on-chip
memory (can be used as workspace for LCD frame buffer)
Other specifications:
-Memory interface (DDR SDRAM, flash memory, asynchronous memory)
-1seg terrestrial digital broadcast reception OFDM interface
-LCD interface, camera interface, ITU-R BT.656 interface
-Security accelerator, 2D/3D graphics accelerator
-Image processor supporting image enlargement/reduction/blending/rotation
-Baseband LSI serial interface, voice/audio serial interface
-USB OTG
-Timer, external interruption, GPIO, UART, I2C, MICROWIRE™
-Memory card interface
Manufacturing
process: 0.13µm CMOS process
I/O power supply: 1.8V
Internal power supply: 1.0-1.2V (during operation), 0.7V (CPU data
retention)
Package: 377-pin FPBGA, 64MB DDR SDRAM System in Package (SiP)