US
: CEVA, Inc. and Spreadtrum Communications announced that Spreadtrum
has successfully developed a 3G TD-SCDMA Chinese standard mobile phone
chipset powered by the CEVA-Teak DSP Core and is production sample
ready.
Spreadtrum's
multi-band chipset SC8800 is the first complete wireless chipset for
GSM/GRPS/TD-SCDMA standards. Powered by the high performance, low
power CEVA-Teak DSP, the chipset enables dual-mode 2G/3G phones to
operate transparently over China's TD-SCDMA and GSM networks.
The world's
first chipset for the China 3G standard marks another first for Spreadtrum.
Since December 2003, Spreadtrum has been shipping GSM/GPRS modules
and baseband chips for 2G/2.5G handsets powered by CEVA-TeakLite DSP
Core to Chinese customers. China's mobile phone population is estimated
at more than 300 million, and averages between four to five million
new users each month (Chinese Ministry of Information Industry).
For the
chipset, Spreadtrum Communications has signed agreements with several
Chinese handset makers such as Amoi Electronics Co., Ningbo Bird Co.,
Lenovo Group Ltd. and Hisense Electric Co. to develop next generation
TD-SCDMA phones. China's 3G standard is due to go live in June 2005.
"Licensing
the CEVA-Teak DSP core was instrumental in slashing our time-to-market
and achieving right first-time silicon. We successfully rolled out
the TD-SCDMA baseband chipset in less than one and a half years,"
said Dr. Ping Wu, Spreadtrum Communications President/CEO. "Our
long-standing partnership with CEVA and its DSP IP solutions has once
again proved to be a success."
"CEVA's
licensing of the CEVA-Teak DSP to Spreadtrum will accelerate the proliferation
and commercialization of 3G in China. Powered by CEVA-Teak, Spreadtrum
are first to market with 3G in China," remarked Chet Silvestri,
President and CEO of CEVA. "China is key to CEVA's growth in
Asia and Spreadtrum's adoption of CEVA-Teak furthers reinforces our
position as a leading DSP technology for wireless communications."
About
CEVA-Teak
CEVA-Teak
is a 16-bit fixed-point general-purpose DSP core. Its dual MAC architecture
features high-performance, high flexibility and throughput for complex
Digital Signal Processing implementations. The core is designed for
low-power, speech and audio processing, multimedia and wireless communications
(GSM, CDMA, EDGE, GPRS, 3G, etc.), high-speed modems, advanced telecommunication
systems, and various embedded control applications. CEVA-Teak is designed
with consideration for low-power uses to achieve the best possible
performance with the lowest possible power consumption. It makes the
core suitable to a wide variety of battery-powered portable applications.