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Production of 3G WCDMA Power Amplifier Module Ramps Up

16th November , 2004

ASIA : Skyworks Solutions announced it has received volume purchase orders from a tier one handset OEM for its wideband code division multiple access (WCDMA) power amplifier (PA) module that is enabling third generation (3G) handsets and providing competitive advantages for manufacturers targeting European, Asian and North American markets.

WCDMA is a 3G mobile wireless technology that allows users to send and receive voice, images and data at speeds of up to 2 Mbps.

"Given Skyworks' long standing leadership position within CDMA, we are pleased to be ramping production of a PA module that supports customers' needs for next generation handsets," said Brian M. Daly, marketing director of RF Solutions for Skyworks. "With its dual mode platform and small form factor, we are enabling and delivering integrated semiconductor solutions that are driving cell phone capabilities from simple voice services to built-in cameras, MP3 functionality and other multimedia applications."

Skyworks' WCDMA PA modules include the SKY77152, a high-efficiency, fully matched PA, and the revolutionary SKY77410 Load Insensitive Power Amplifier (LIPA(TM)) module, which delivers full RF performance even into an output load-mismatch of 4:1 voltage standing wave ratio (VSWR).

The LIPA(TM) model is a 16-pin product that, like the SKY77152, features a low current control (Vcont) pin to maximize power efficiency in both high and low RF power ranges, and a separate bias control (V BIAS) pin that can be directly connected to the battery, allowing the battery supply voltages (VCC1 and VCC2) to be operated as low as 0.8V.

Furthermore, the LIPA(TM) technology supports handset manufacturers who choose to use a single PA to span multiple frequency bands. The same product can be used in both the 1920 MHz-1980 MHz International Mobile Telephone Standard (IMT-2000) band and the 1850 MHz-1910 MHz Personal Communications Services (PCS) band, providing competitive advantages for larger handset OEMs, ODMs and contract manufacturers who are targeting European, Asian and North American markets.

LIPA(TM) modules are packaged in Skyworks' low-cost, 4mm x 4mm x 1.5mm laminate-based multi-chip module (MCM) packages that contain all active circuitry, including onboard bias circuitry, as well as input and output interstage matching. It also eliminates power-consuming isolator circuitry, significantly reducing cost and board space while dramatically increasing talk time.

These products are manufactured using Skyworks' industry-leading single-chip 50 GHz gallium arsenide (GaAs) heterojunction bipolar transistor (HBT) process technology with an indium gallium phosphide (InGaP) emitter, which provides for all positive-voltage DC supply operation while maintaining the highest power efficiency and excellent linearity.

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