15 Megapixel Camera Phone Image Sensor
15 Megapixel Camera Phone Image Sensor
2nd November , 2009
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Japan : A new CMOS image sensor will provide camera mobile phones with 14.6 million pixel capability and much improved image quality. The new image sensor has been released by Toshiba and is the newest addition to the Dynastron range.
The new 14.6 million pixel image sensor, is also the first by Toshiba to include a back side illumination ( BSI ) feature. The new image sensor will ship commencing July 2010 with sampling commencing next month.
The new level of imaging and processing quality has been achieved by Toshiba using BSI technology to pack 14.6 million image pixels onto a 1x2.3 inch sensor. The target markets for the new sensor are digital cameras and camera mobile phones.
BSI brings new levels of responsiveness to CMOS imaging. Lenses are deployed on the rear of the sensor on the silicon substrate, not on the front, where wiring limits light absorption. This positioning boosts light sensitivity and absorption by 40% compared to existing Toshiba products, and allows formation of finer image pixels.
The new sensor will be mass produced at Toshiba's Oita Operations, on industry leading 300mm wafer lines deploying 65nm process technology. Initial production will be at a volume of 500,000 sensors a month.
CMOS image sensors are a focus product of Toshiba's System LSI business. Until now, their main application has been in mobile phones, where Toshiba could leverage its high density integration and low power consumption technologies. With the introduction of BSI CMOS sensors, Toshiba will reinforce the sensor business by expanding application to include digital cameras.
Specification
Optical format: 1/ 2.3 inch
Number of pixels: 14.6 mega pixels
Size of pixels: 1.4 micro meter
Frame rate: 60 frame per sec. (Supports 1080p, 720p)
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