ASIA
: TechFaith Wireless announced it has released its first 3G phone.
The phone is available in Italy and features Qualcomm's 6250 chipset,
with WCDMA/GSM mode. The candy bar shaped phone is 19mm thick, with
64MB memory capable front 100K and rear 300K pixel cameras.
Defu
Dong, Chief Executive Officer of TechFaith, said, "This is a
very
important milestone for TechFaith as it expands our presence internationally
and expands our offerings of products with advanced technology. 3G
phones are appealing to consumers because of their support for applications
other than voice, such as high speed Internet, video on demand services,
graphics and video games. We expect our first 3G phone to be a successful
product based on the strength of the phone itself, combined with the
brand owner and the carrier that we are working with. We intend to
customize this product for additional carriers."
According
to QUALCOMM Incorporated, well over 128 million people around the
world now subscribe to 3G wireless services based on CDMA2000 and
WCDMA (UMTS). Services based on these ITU-approved standards have
been launched by 104 operators in 46 countries.
About China TechFaith
China TechFaith is one of the largest handset application software
and handset solution providers based in China. With the technology
capabilities in developing MMI on GSM/GPRS, CDMA1X, EVDO, WCDMA/UMTS,
HSDPA, TD-SCDMA and Wi- Fi technologies, China TechFaith is able to
provide MMI software which fulfills the major global operators' standards.
China TechFaith provides handset application software including WAP,
Java, MMS, WWW browser, SyncML, DRM, etc. China TechFaith also provides
total solutions for handset software development. In addition, China
TechFaith has the capability to develop SmartPhone based on Linux,
Windows CE and Brew operation systems. Based on the above technology
capabilities, China TechFaith provides full range services in handset
design to satisfy different customers' needs. Our services include
(i) handset design solution; (ii) turkey software and design solution
on chipset; (iii) application software; and (iv) wireless module and
wireless application products.