New Lab To Focus on China's 3G Standard, TD-SCDMA

ASIA / US : Comlent Technology and Agilent Technologies announced that they have jointly established “Comlent-Agilent TD-SCDMA Reference Lab (China)."

Inset shows Comlent headquarters in Shanghai, China.

This new lab has been oriented for the R&D, test and validation of RFIC, RF module and mobile terminal performance following TD-SCDMA, the third 3G international standard favored by China in addition to WCDMA and CDMA2000 that are respectively mostly deployed in Europe and US.

Comlent has selected Agilent's RF and mixed-signal design software tools as its new benchmark for mobile communications RFIC development. Agilent's RF Design Environment (RFDE) will provide Comlent’s designers with efficient circuit simulation and system design. This lab will help to accelerate the development and maturity of RF technology for China’s TD-SCDMA chain, which may include but not limit to Comlent’s partners in both terminal and Base Band IC design. As the largest mobile handset market in the world, China has had 400 million mobile subscribers with a net growth of approximate 55 million per year during the past few years. Meanwhile, China has also been the world’s largest mobile phone manufacturer. In 2005, 268 million mobile handsets were made in China for both domestic and export markets, according to China’s CCID under Ministry of Information Industry (MII).

“As China’s first proven RFIC design house with transceiver and power amplifier (PA) chips in mass production, Comlent, during the past three years, has invested over 10 million US dollars to establish a leading position in China. As part of the strategy, Comlent has built a most competitive technical team and powerful local marketing channels, as well as won strong government support in China,” stated by Dr. Kai Chen, President and CEO of Comlent. “Comlent will continue to intensify our investment to entrench our leading position in providing world-class IC technology, best support and quality service to local customers with a focus on China’s specific markets such as TD-SCDMA for 3G mobile communications. Fastest time to market and penetration through win-win alliance and partnership, as demonstrated by this cooperation with the world’s leading RF EDA and testing equipment vendor Agilent, also contribute as one cornerstone of Comlent’s winning strategy.”

“Comlent Technology Inc. is a major developer of communications ICs in China, and a strong supporter of our RF Design Environment,” said Howsiang Yap, Asia Regional manager, Agilent EEsof EDA Division. “As China’s 3G market starts growing up, we are glad to cooperate with Comlent, a famous local RFIC company, in building up the core competitive advantage — our EDA solution and RFIC consulting service play a critical role in the overall development of RFICs, helping make mobile and wireless communication products designed more quickly and efficiently.”

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