Infineon Reveals Dual Mode WLAN System

Infineon Technologies announced its 802.11 a/b/g dual band, multi mode system for WLAN solutions and will present the industry’s highest integrated dual band single chip transceiver with outstanding measurement results.

Infineon will offer to customers a complete WLAN solution including chipset, evaluation boards, reference designs, firmware and software drivers, and full customer support. To meet the growing demand for high data rate wireless LAN systems providing business and residential users with flexible access to email and the Internet, the solution will be targeted to manufacturers of communication and computing equipment. The system consists of four ICs with outstanding performance and integration results.

The Transceiver performance measurements demonstrate full 54 Mbit/s capability in the 5 GHz and 2.4GHz frequency band, while this first time right design underlines Infineon’s ability to transfer its world class RF know how to all wireless standards creating highly integrated and most competitive solutions. The new transceiver outperforms all standard targets for sensitivity (for maximum range), transmission mask (for minimum interference), multi path robustness and spectrum flatness.

The Infineon Power Amplifier IC (PA) is a fully integrated dual band 2.4 GHz / 5GHz device, offering highest RF performance using SiGe technology. The PA integrates all necessary bias circuitry, power control loop components and stand by circuitry allowing a maximum component reduction in the front end of the WLAN system. Infineon utilized its proven bipolar PA know how from cordless systems to come up with this outstanding device.

The Media Access Controller (MAC) which is compliant with the 802.11a, b and drafted-g standards provides the access controller and data management functions on the chipset. It delivers added flexibility with a broad range of interfaces for PC, consumer electronics and networking applications such as PC Card, MiniPCI, PCI, Cardbus, Compact Flash and USB 1.1.

The modem IC (PHY) is designed implementing Infineon’s high performance low current A/D converters and its long experience in OFDM modem development. This results in a low implementation loss device and thus in a maximum range WLAN system.

„The demonstration of our dual-band transceiver represents an important milestone in our WLAN developments”, explained Hubert Christl, Vice President and General Manager Local Area Wireless at Infineon Technologies. „Our solution ensures the leading position of our customers in time to market and lowest bill of material by eliminating many external components that are required in other systems.”

Infineon’s new dual band transceiver offers leading edge performance with full 54 Mbit/s operation at superior range in both 2.4 and 5 GHz frequency band. The solution supports the standard extensions for 802.11e, i, h. The dual band multimode solution provides high levels of flexibility, reliability and data rate for a wireless network connection. The 802.11g standard with a maximum throughput of 54Mbit/s, which is compatible with 802.11b, provides important connectivity with the most widely developed wireless network standard in the world, while the 802.11a support allows users to take advantage of the high-performance 54Mbit/s data rate with higher overall bandwidth for more user.

According to IDC, an industry analyst firm, the total market for wireless LAN chips is expected to grow at a compound annual growth rate of nearly 30 percent from $331 million in 2001 to $1,200 million by 2006. Current applications are supported by today’s 11 Mbit/s 802.11b technology. As new services emerge and the numbers of end-users grow, the bandwidth required in enterprise networks will rise significantly. The market will increasingly migrate to multimode solutions that combine 802.11a, b, and g technologies, while operating in both the 2.4 and 5 GHz frequencies. Multimode solutions are projected to represent as much as 57 percent of the total wireless LAN chip market by 2006, according to IDC.

Infineon and Agere have signed an agreement to co-develop, supply and support reference designs that include all of the components required by network equipment, consumer electronics and PC manufacturers to offer end products with wireless networking capabilities. Both companies will independently market next-generation wireless LAN products. By developing a solution that leverages the respective strengths of each company, Infineon and Agere and Infineon will help drive the deployment of wireless LAN. Infineon plans to deliver silicon samples of the complete dual band dual mode system solution in second quarter of 2003.

This Press Release Sponsored by AGILENT TECHNOLOGIES

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