
| ALL TODAY'S PRESS RELEASES SEE BELOW |
| Seemless Connectivity In The Wireless World |
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7th March 2003 |
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The collaboration, the IDA-Intel Wireless Hotspots & Network Interworking Initiative, is significant for Singapore and Asia as a whole, in that it is the first of its kind to involve the participation of operators and vendors from across the Asia-Pacific region and beyond. Through the interworking study and interoperability lab test, IDA and Intel look forward to the joint participation of operators and vendors from Asia Pacific, such as Korea, China, Japan, Hong Kong, Taiwan, Australia, and beyond, and to the interlinking of these activities through Singapore, as Asia's living digital lab. "IDA is pleased to work with Intel on the complex technical and business challenges in achieving seamless connectivity in the wireless world for Singapore and Asia. IDA, through this collaboration, will help to bring together different industry players of the fixed and wireless value-chain, to provide consumers a truly connected experience. Through this, we hope to also provide the impetus for a new source of revenue growth for the Infocomm sector." said Mrs Tan Ching Yee, Chief Executive Officer of IDA. "As WiFi-deployed data services become increasingly important to the mobile industry, it is critical that end-users be able to easily move between different WiFi networks," Pat Gelsinger, Chief Technology Officer of Intel Corporation said. "This initiative is part of Intel's ongoing worldwide efforts to deliver compelling wireless computing experiences to end-users, anywhere on any device." "Intel silicon products are the computing "engines" at the heart of thousands of millions networks around the world," added Gerry Greeve, Vice President and General Manager Intel Asia Pacific. Consumers are now one step closer to enjoying a liberated roaming environment across networks, to achieve anytime-anywhere online access. Currently, there are different operators providing services on different fixed-line and wireless networks which are based on different technical standards. This has resulted in multiple but isolated pockets of connectivity. In turn, consumers end up having to subscribe to different operators and receiving different bills, while grappling with the inconvenience of switching networks, such as remembering different passwords for different networks. The IDA-Intel collaboration provides the glue that bridges the different Wireless LAN1, Wireless WAN(WWAN)2 and Fixed Wide Area Network(WAN)3 networks to achieve seamless connectivity and provide consumers with a more enhanced wireless lifestyle. With this, Wireless LAN users can enjoy the same kind of mobility, connectivity and seamlessness as today's mobile phone user, who can send SMS (short message service) and MMS (multi-media messaging service) messages across different networks. "We see Singapore as an early adopter of wireless technology. Given its success with SMS and MMS interoperability efforts, as well as its standing as the gateway to Asia, Singapore is an ideal location for Intel to test and launch its R&D efforts to the rest of Asia, if not the world," Mrs Tan said. The three-way technology collaboration comprises an interworking study, interoperability lab test and a technology exchange programme. The Interworking
Study The interworking study culminates in a blueprint that defines the steps needed to achieve seamless connectivity by incorporating user roaming requirements, developing a harmonized interworking architecture, and finally submitting the proposed architecture to the relevant standards4 body for consideration. The study is expected to commence in April 2003 and the blueprint ready a year later. The Interoperability
Lab Test "The interworking study and interoperability lab test will produce reference designs to guide industry deployment and standardization. This will in turn prevent Singapore's fixed and wireless networks from fragmenting into several, potentially proprietary implementations." said Mrs Tan Ching Yee, CEO of IDA. Technology Exchange
Programme The total investment value of the IDA-Intel Wireless Hotspots and Network Interworking Initiative is S$3.9 million, which comprises mainly manpower and equipment costs. |
This
Press Release Sponsored by AGILENT TECHNOLOGIES |
| TODAY'S
PRESS RELEASES |
Spb
Software House, a leading developer of Pocket PC Software, announced today
the release of Spb GPRS Monitor 2.0, a significant update to the popular
software for users with wireless Pocket PCs. |
Both
the mobile operators and the terminal manufactures are still not quite
sure exactly what will trigger the 2.5G and 3G markets, thereby ensuring
a smooth and speedy transition. |
This
acquisition will strengthen Infineon's position in the 3G sector and enlarge
its IP portfolio for multi-standard wireless solutions. It will also broaden
Infineon's product range for the 3G infrastructure market with programmable
chips for digital baseband signal processing, enabling Infineon to cover
the entire signal processing chain. The terms and conditions of the acquisition
were not disclosed. |
Matsushita
Electric announced the development of a chipset consisting of a 5GHz wireless
LAN signal processor designed for IEEE802.11a/e compliant wireless transfer
of video images among home AV equipment, and high frequency radio chips
featuring low power consumption, low distortion, and low noise. |
Together
with Ericsson, BT and Intel, IBN will create a network named "The
Cloud" planned to expand to 30,000 Hot Spots over the next three
years. IBN will sell wholesale capacity to branded service providers like
mobile and broadband operators as well as pay-as-you-go services at the
Hot Spots. |
T-Mobile
has partnered with Universal Mobile, the mobile entertainment services
subsidiary of Universal Music International, to market exciting new music
content across the t-zones portal in major European markets. |
The
Infocomm Development Authority of Singapore (IDA) and Intel Corporation
today signed a Memorandum of Intent (MOI) to formalize their collaboration
to pave the way for seamless connectivity between the fixed and wireless
worlds. |
The
A1301S supports CDMA2000 1x and in addition to being able to record conventional
size movies (96 x 80 dots), it can also record larger size movies (128x
96). There is a ’’MOTION EYE” integrated camera and
photo light built into the hinge section of the clam-shell shaped phone
which enables it to rotate approx. 290 degrees. |
Newly
merged KTF will launch a commercial service of third-generation (3G) phones
in June, moving a step closer to the full-scale mobile transmission of
video data. |
Disco
and Wirebee will jointly promote Superscape's 3D Swerve enabling technology
for mobile phones and PDAs to the Japanese marketplace. Swerve has been
developed by Superscape specifically for wireless platforms, providing
the ability to deliver a wide range of 3D applications including games
and menuing systems. Japan is the largest and most innovative market in
the world for games on mobile phones. |
The
first CDMA phone with integrated Bluetooth™ wireless technology
available in the United States. This latest introduction also offers a
look at the new Sony Ericsson industrial design that the company is using
for its new mobile phones. |
The
T310 mobile phone offers great gameplay with its joystick and colour display,
also taking advantage of its 32 polyphonic sounds and vibrating force
feedback to bring as much as possible of the game console feeling to the
mobile environment. |
PacketVideo
Corporation announced that it has provided the multimedia functionality
embedded in the Sony Ericsson P800 smartphone, based on Symbian OST (operating
system). |
T-Mobile
and 3G LAB tannounced the first Europe-wide implementation of Trigenix
mobile interface technology. T-Mobile will be using 3G LAB's award-winning
Trigenix technology to give its customers access to dedicated t-zones
content channels through branded and customised interfaces on mobile phones.
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Racal
Instruments has devised a set of wall-charts summarising the UMTS layer
1 technical standards as a reference guide for all engineers working on
Layer 1 (and higher layers) in mobile communications design and test.
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