Industry-First Commercialization Milestones Achieved for HSUPA Technology

US : QUALCOMM announced that the Company has achieved significant milestones toward bringing fully wireless broadband capabilities to WCDMA (UMTS) networks in 2007, including:

* Successful completion of the industry's first HSUPA test calls
delivering 2.0 Mbps on the uplink
* Launch of interoperability testing with multiple leading infrastructure
providers
* Ten major device manufacturers now designing products based on
QUALCOMM's HSUPA chipset solution
QUALCOMM will be demonstrating 2.0 Mbps uplink video streaming and file transfers at EXPO COMM Japan 2006, July 19-21 in Booth #C-285.

"QUALCOMM's technology leadership has made possible the successful accomplishment of these milestones, bringing richer broadband wireless entertainment, personal convenience and enterprise services closer to reality," said Alex Katouzian, senior director of product management for QUALCOMM CDMA Technologies. "Additionally, our close collaboration with device manufacturers, operators and infrastructure vendors is quickly driving HSUPA to market for wireless users around the world."

For WCDMA (UMTS) networks, HSUPA technology, together with HSDPA technology, delivers data speeds surpassing those of many home broadband connections. QUALCOMM's Mobile Station Modem(TM) (MSM(TM)) MSM7200(TM) chipset, the industry's first HSUPA solution, was used for the test calls and interoperability testing. Ten leading device manufacturers are already designing handsets based on the chipset, which offers industry-leading levels of integration to deliver significant bill-of-materials savings and to enable slim, sleek devices with support for advanced multimedia and data capabilities.

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