Europe Italy : M2M industry leader Telit Communications will unveil a series of products including a new UMTS/HSDPA module and a CDMA-dual-band module at the 2007 3GSM World Congress in Barcelona in February 2007. In addition, Telit will showcase a wide range of innovative M2M applications at its booth (Hall 1, E 44), demonstrating the impact of M2M on a variety of vertical markets.

The new UMTS/HSPDA UC864 ( see above ) module provides high-speed connectivity while maintaining physical compatibility to its GSM/GPRS complementary, the GC864, which to this day is one of the world's smallest GSM/GPRS modules. The UC864 provides an instant upgrade path for applications benefiting from higher data rates and is EDGE-compatible. Visitors at 3GSM will have the chance to watch a live demo presentation of the new module at the Telit booth.

In addition, the international M2M expert will showcase its new CDMA-dual-band module, the CC864-Dual. The CC864-Dual is a CDMA-1XRTT wireless module designed to have same form, fit and function as its GSM/GPRS counterpart product, the GC864. This enables integrators and developers to design their application once and take advantage of the global coverage and service flexibility afforded by the combination of the two most prevalent cellular technologies worldwide.

"With these two new modules Telit once again demonstrates its commitment to providing customers with the most innovative and cost-effective solutions in the M2M market," says Dominikus Hierl, President Telit Wireless Solutions.

Close to M2M

Beyond its new modules, Telit will also present a wide range of innovative vertical M2M applications for tracking and tracing, industrial automation, security and telemetry.

"All these state-of-the-art applications will demonstrate the benefit of M2M technology for daily life," said Felix Marchal, VP Global Sales, Telit Wireless Solutions. "They will also outline what the near future could look like."