Chipset Supporting 3G WCDMA Selected by LG Electronics

QUALCOMM and LG Electronic announced the selection of the QUALCOMM MSM6200(TM) Mobile Station Modem (MSM(TM)) chipset and system software for LG's dual-mode third-generation (3G) handsets. A highly integrated, single-chip multimode solution, the MSM6200 chipset supports the Frequency Division
Duplex (FDD) mode of WCDMA (UMTS) and GSM/GPRS. The complete MSM6200 WCDMA solution includes the MSM6200 modem, and the RTR6200(TM), RFL6200(TM) and RFR6200(TM) direct conversion multimode chips.

Inset is the cdma2000 1x EV-DO LG-KH5000 manufactured by LG.

"Our partnership with LGE in driving the deployment of CDMA2000 1X and
1xEV-DO has been very successful, and we are pleased that LGE has selected our
MSM6200 chipset and system software for their next generation of UMTS
devices," said Don Schrock, president of QUALCOMM CDMA Technologies. "With
the dual-mode MSM6200 solution, LGE will be able to enhance their phones to
support both 3G UMTS and GSM/GPRS capabilities."

"LGE was the first company to demonstrate video telephony on a
3GPP-compliant handset," said James Kim, president of LG Electronics, Inc.
"Our selection of the MSM6200 chipset will enable us to continue leading the
UMTS marketplace."

The MSM6200 chipset is the latest version of QUALCOMM's WCDMA/UMTS family
of solutions and supports data rates of up to 384 kbps in WCDMA/UMTS mode.
The RTR6200 chip provides an integrated GSM/GPRS transceiver for GSM-900 and
GSM-1800 bands, and a UMTS transmitter. The WCDMA receive function in the
complete MSM6200 solution is performed by the RFL6200 chip, which is a low-
noise amplifier (LNA), and by the RFR6200 chip, which contains the direct-
conversion mixer and local-oscillator generator.

Like all members of the MSM6xxx family, the complete MSM6200 solution
incorporates QUALCOMM's radioOne(TM) Zero Intermediate Frequency (ZIF)
architecture, which eliminates the need for Intermediate Frequency (IF)
components, including large IF Surface Acoustic Wave (SAW) filters and
additional IF circuitry. With radioOne technology, the MSM6200 solution
requires less printed-circuit-board area than previous-generation chipsets and
reduces bill-of-material costs for dual-mode handsets.
The MSM6200 solution also supports QUALCOMM's Launchpad(TM) suite of
advanced multimedia, connectivity, position location, user interface and
removable storage functionality.

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