Ceva for Samsung 3G Phones

19th April , 2004

Above : CEVA-X 1620 core Block Diagram

US : CEVA, Inc., the leading licensor of Digital Signal Processor (DSP) cores and communications solutions to the semiconductor industry, today announced that Samsung Electronics Co., Ltd., the world's third largest manufacturer of mobile phones, has licensed the CEVA-X1620 DSP core to power Samsung's next generation 3G multimedia handsets.

CEVA-X1620 DSP core is the first implementation of the CEVA-X architecture that was launched in December 2003. CEVA-X is a scalable VLIW-SIMD DSP architecture delivering breakthrough performance, at low power consumption. Uniquely, the CEVA-X is designed as a multipurpose architecture allowing it be deployed efficiently in a broad range of markets such as 2.5G/3G multimedia phones, PDAs, Digital Cameras and Camcorder, DTV, HD-DVD and more. CEVA-X enables licensees to efficiently develop software using high-level languages such C and C++ allowing re-usability and fast time to market.

Samsung has licensed the CEVA-X1620 dual MAC 16-bit, fully synthesizable DSP core for cellular and applications processing for Samsung's next generation 3G cellular phones. CEVA and Samsung have had a long-standing partnership in DSP with Samsung having previously licensed and deployed the CEVA-TeakLite and CEVA-Teak DSP cores.

"CEVA-X is an outstanding technology delivering high performance and scalability to DSP which will enable Samsung handsets with new levels of communication and multimedia capabilities," said KyungHo Kim, Vice President of Samsung. "Samsung and CEVA have successfully partnered in the past in DSP technology, and we are pleased to be the lead partner for the very exciting CEVA-X DSP technology."

"Our agreement announced today with Samsung, a world leading player in the mobile industry, is a tremendous endorsement of CEVA-X's breakthrough performance, scalability and ease of programmability," said Chet Silvestri, Chairman and CEO of CEVA. "We are confident that CEVA-X will further extend our position as the industry leading provider of DSP technology and expand our reach to new application segments."

CEVA-X1620 is specifically designed for cost driven, low power applications where convergence of communication and multimedia is a necessity. Independent benchmarks by Berkeley Design Technology (BDTI), have demonstrated that the CEVA-X1620 will be faster than all DSPs in its class.*

CEVA-X1620 Features
-- 16-bit Fixed-Point Dual MAC architecture
-- Unique mix of Very Long Instruction Word (VLIW) and Single Instruction
Multiple Data (SIMD)
-- High frequency - up to 450 Mhz @ 0.13u (worst case)
-- High-DSP performance. For example:
-- 2 cycle FFT butterfly
-- Single cycle Viterbi Add-compare-select
-- Up to 8 instructions in parallel
-- Variable instruction width (16 or 32-bit) and variable instruction
packets
-- Ultra low dynamic power consumption achieved by a built in mechanism
which shuts off any unnecessary logic
-- Enable Customer Extensions
-- Highly efficient C/C++ Compiler
-- Complete software and hardware development environment

TODAY'S PRESS RELEASES
All Material Subject to Copyright. All logos, graphics and trademarks are the property of their respective owners.

Home ProZone Subscribe To Newsletter 3G Forum