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TI Enhance New FOMA(TM) 3G Handsets |
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7th April , 2004 |
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Europe : Texas Instruments announced that TI's OMAP(TM) application processor is featured on new models of FOMA '900i Series'3G (third generation) handsets from NTT DoCoMo, Inc., including the N900i from NEC, P900i from Panasonic Mobile and SH900i made by Sharp. The FOMA 900i series are the first 3G phones equipped with a Macromedia(R) Flash(TM) browser. i-appli(TM) applications offer a 400K scratch pad and up to 100K for content/archiving compared to 200K and 30K in existing FOMA models. Some of the new functions available in the 900i phones include: Deco-mail(TM) HTML e-mail; Chara-den(TM), an Avatar-capable videophone; and Chaku-motion(TM), a feature that enables the user to combine video and high- quality music to signal incoming calls. TI's high-performance, power- efficient OMAP(TM)1610 processor series helps enable these rich, real-time multimedia-rich features as well as longer battery life.
TI's OMAP platform is comprised of high performance, power efficient processors, a robust software infrastructure and comprehensive support network for the development of differentiated 2.5G and 3G multimedia-enhanced mobile devices and software applications. The OMAP1610 series, announced in February 2003, significantly advances multimedia applications performance required for mobile applications like video and gaming. At the same time, they also help handset manufacturers slash power consumption. Enabling a small, sleek form factor, price/performance ratio, multimedia capabilities, and maximum power-savings, TI's OMAP processors give handset makers maximum design flexibility. 'NTT DoCoMo and their major partners have been at the forefront of advancing the capabilities and performance of the cell phone,'Alain Mutricy, TI Vice President and Worldwide Cellular Systems General Manager commented. 'NTT DoCoMo and major handset manufacturers such as NEC, Panasonic and Sharp are bringing breakthrough multimedia services to consumers. We are pleased to continue supporting these industry pioneers in the ongoing development of 3G technology, by coupling their premiere technologies with TI's OMAP platform.' TI - Making Wireless TI is the leading manufacturer of wireless semiconductors, delivering the heart of today's wireless technology and building solutions for tomorrow. TI provides a breadth of silicon and software and 15 years of wireless systems expertise that spans handsets and base stations for all communications standards, wireless LAN, Bluetooth and Ultra Wideband. TI offers custom to turn-key solutions, including complete chipsets and reference designs, OMAP application processors, as well as core digital signal processor and analog technologies built on advanced semiconductor processes. |
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