Generation UMTS

21st January , 2004

US : TransDimension announced that NEC Electronics Corporation (TSE), a leader in Large Scale Integration (LSI), has licensed its USB On-The-Go (OTG) technology to integrate into their next generation LSI chip for third generation (3G) mobile phones.

Inset is Rick Goerner, TransDimension President and Chief Executive Officer quoted below.

The announcement with NEC Electronics marks TransDimension's entry into the Japanese cellular phone market.

Through TransDimension's USB OTG technology, NEC Electronics will leverage the readily available USB standard to obtain direct connectivity for its 3G phones with other mobile devices and computer peripherals. USB OTG will greatly enhance the connectivity feature set of 3G phones by providing access to other smart devices, like digital cameras, PDA's and computer peripherals to exchange data without the aid of a PC.

"The next-generation of mobile phones will be required to offer a rich multimedia experience to the end-user. A necessary part of that experience will be the ability to share data with other users through direct connectivity to other smart devices," said Rick Goerner, TransDimension president and CEO. "NEC will leverage our USB OTG technology to quickly and cost effectively introduce a proven, high performance USB solution into their LSI chip."

Having previously announced design wins with Qualcomm and Motorola, TransDimension's partnership with NEC Electronics is further validation that interconnectivity between smart mobile devices is a priority for major cellular phone manufacturers and TransDimension's USB OTG technology is experiencing rapid market adoption.

"This announcement with NEC Electronics is a milestone for TransDimension as it is our first licensing agreement in the Japanese cellular phone market. We now have major design wins with some of the biggest players in the cellular phone industry which validates USB as a solution for direct connectivity between mobile devices," added Goerner. "This announcement is a direct result of our ongoing commitment to offer the industry's most complete OTG solution, consisting of our USB OTG controllers, and our USBLink software and class drivers."

TransDimension recently entered into a collaborative partnership with ARM, Ltd. whereby TransDimension's technology has been validated with ARM-based systems and is now marketed to ARM(R) Partners, such as NEC Electronics, who can therefore rely on the technology to integrate seamlessly with their SoC design. TransDimension will continue to leverage the partnership with ARM to develop further relationships with manufacturers of mobile devices.

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