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Improved 3G Wireless Application CPUs

8th January , 2004

ASIA : Elpida Memory, Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced the availability of its 64 Megabit single data rate (SDR) Mobile RAM devices. The new devices deliver low-power consumption and high-bandwidth performance to cellular products, and they also utilize edge pads which allow the devices to be easily, and cost-effectively, integrated into multi-chip package (MCP) and System-in-Package (SIP) designs.

"Current and next-generation cellular applications require high-bandwidth capability within a low-power environment," said Jun Kitano, director of Technical Marketing for Elpida Memory (USA). "Elpida's 64 Megabit Mobile RAM devices meet the performance demands of the cellular market and use edge pads that allow customers to easily package the memory devices with the processor in MCP and SIP designs."

Mobile RAM for Cellular Applications

Application CPUs of advanced 2.5G and/or 3G cellular phones require high-density (128 Megabit, 256 Megabit) and high-speed memory devices. Base-band CPUs traditionally use NOR Flash plus SRAM or Pseudo SRAM for memory functions. However, base-band CPUs now cover voice communication as well as multimedia services, thus a higher density (64 Megabit to 128 Megabit) and higher bandwidth performance than that provided by SRAM is necessary. Therefore, many base-band CPUs are starting to support a Mobile RAM interface. Elpida's new 64 Megabit Mobile RAM device satisfies the new base-band CPU requirements.
Another major benefit of using the 64 Megabit Mobile RAM device is its ease of implementation into MCP and SIP designs. Elpida's new devices facilitate this process further through the use of edge pads.

64 Megabit SDR Mobile RAM Features

Elpida's new SDR Mobile RAM devices (Part numbers: EDL6416CABH, ECL6416CACN, EDL6416BABH, ECL6416BACN) are organized as 1M words x 16-bits x 4 banks, and they have a low-voltage operation of 1.8V or 2.5V, respectively. The devices operate at 133 MHz (2.5V) or 100 MHz (1.8V), and they offer a CAS latency (CL) of 2, 3. They are available as 8 millimeter (mm) x 8 mm, 54-ball FBGA packages or as a bare die.
Elpida's Mobile RAM devices offer an advanced feature set that includes auto temperature compensated self-refresh (ATCSR). Auto TCSR automatically changes the internal self-refresh period based on temperature and eliminates the need for external operation/control to reduce the self-refresh current. The devices also support deep power-down mode and Partial Array Self Refresh (PASR) to further reduce power consumption, thus allowing for increased battery life.

Elpida offers a broad Mobile RAM product line-up ranging from 64 Megabit to 256 Megabit densities.

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