Skyworks Unveils Industry’s Smallest 3G WCDMA Power Amplifiers
Smallest 3G WCDMA Power Amplifiers with Integrated Directional Couplers
16th February, 2009
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Europe : Skyworks Solutions introduced a family of single and dual-band WCDMA power amplifiers (PA) for universal mobile telecommunications system (UMTS) applications that integrate the directional coupler, significantly reducing the phone board footprint and bill-of-material costs.
The company’s expanded portfolio of front-end solutions now includes five of the world’s smallest and highest performance UMTS PAs that support Bands I, II, IV, V and VIII, and two dual band PAs that support the most popular band combinations – bands I/VIII and II/V. These compact solutions provide seamless operation and offer high power added efficiency (PAE) at mid and low powers, significantly increasing talk times.
“Skyworks is proud to continue its tradition of delivering industry-leading solutions that meet today’s demanding 3G requirements,” said Gregory L. Waters, executive vice president and general manager, front-end solutions. “Our newest family of power amplifiers offers significant benefits to handset OEMs who must constantly address size, cost and performance issues across a broad range of frequencies.”
Skyworks’ Family of WCDMA Power Amplifiers
Skyworks’ Intera™ portfolio now includes the:
- SKY77186 for Band I: 1920-1980 MHz
- SKY77187 for Band II: 1850-1910 MHz
- SKY77188 for Band V, VI: 824-849 MHz
- SKY77189 for Band VIII: 880-915 MHz
- SKY77191 for Band IV, IX, X: 1710-1785 MHz
The five small and efficient 3 x 3 millimeter (mm) solutions are fully matched, 10-pad surface mount modules. Because of high efficiencies attained throughout the entire power range, the devices deliver unsurpassed talk-time advantages. They also meet stringent spectral linearity requirements of high-speed downlink packet access (HSDPA) data transmission with high PAE.
- SKY77195 for Bands I and VIII: 1920-1980 MHz and 880-915 MHz
- SKY77196 for Bands II and V: 1850-1910 MHz and 824-849 MHz
The two 4 x 5 mm dual band PA modules provide convenient solutions for these increasingly popular phone models. Skyworks’ revolutionary integration techniques pack most of the external passive components into the modules, requiring only two external bypassing capacitors for the two bands compared to 10-14 passives typically required with two single band PA modules. This results in unmatched bill of materials count savings as well as up to 40-50 percent board area savings, enabling OEMs to devote more functionality to the phone without increasing its size.
The single gallium arsenide (GaAs) microwave monolithic integrated circuit (MMIC) contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits. Output match into a 50-ohm load is realized off-chip within the module package to optimize efficiency and power performance.
The PA modules are manufactured with Skyworks’ indium gallium phosphide (InGaP) heterojunction bipolar transistor (HBT) bipolar field effect transistor (BiFET) process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity.
Pricing and Availability
Samples are currently available, with volume production scheduled to commence the quarter.
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