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Reference Design Platform For 2.5G & 3G Cellular

26th February , 2004

Europe France : Comsys Communication introduced today its chip reference design platform for cellular baseband solutions. The baseband board platform, designed to support multi protocol cellular standards including EDGE, GPRS, GSM and UMTS is a full solution for silicon vendors and ODMs with internal silicon design capabilities to reduce time to market for their solutions.

Comsys’ 3G baseband board provides full baseband functionality required in a cellular handset, enabling developers to develop chips faster and more cost-effectively. Designed for multi-mode support, the chip reference design platform is flexible to reflect different vendor architecture needs. The platform board has discrete analog baseband functionality and includes an ARM9 processor, an FPGA for dedicated logic, a DSP interface proven for CEVA DSP cores and an add-on RF interface module enabling easy interfacing to any RF.

Elkana Ben-Sinai, Comsys CEO remarked, ”This board exploits the proven strength of Comsys’ full system solutions. We are enabling developers to quickly and cost-effectively realize a complete and integrated 2.5G and 3G baseband chip or module. With our advanced baseband board platform, silicon vendors can move rapidly from IP to silicon and be ready earlier to address their customers’ needs”.


Comsys Communication and Signal Processing Ltd. provides a complete licensable baseband solution for EDGE, GPRS, GSM and UMTS. Comsys and its partners offer integrated baseband system IP solutions including the complete physical layer and protocol stack (L1/2/3) as well as the underlying system hardware. These solutions have already been ported onto multiple DSP platforms.

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