Backman
15-10-2007, 10:33 AM
Broadcom Corporation announced a new single-chip HSPA (high-speed packet access) processor that integrates all of the key 3G (third generation) cellular and mobile technologies on an extremely low power, single 65 nanometer CMOS die. Broadcom's new "3G Phone on a Chip" solution enables manufacturers to build next generation 3G HSUPA phones with breakthrough features, sleek form factors and very long battery life, all at a fraction of the cost of today's solutions - driving widespread consumer adoption.
Never before has anyone integrated as many radio devices on a single chip, which demonstrates Broadcom's technology leadership in multi-modal CMOS RF technology.
Read Full story plus photo here (http://www.3g.co.uk/PR/Oct2007/5279.htm)
Never before has anyone integrated as many radio devices on a single chip, which demonstrates Broadcom's technology leadership in multi-modal CMOS RF technology.
Read Full story plus photo here (http://www.3g.co.uk/PR/Oct2007/5279.htm)